ID 型号 品牌 批号 封装 数量
4349 BCM6752KFEBG BROADCOM 20+ BGA 1
4350 RN8211 锐能微 08+ QFP64 174
4351 BL55076 BELING 09+ QFP64 175
4352 MT7615N MEDIATEK 21+ QFN 7
4353 D78F0525A NEC 10+ QFP 210
4354 R5F212B8SDB07FP RENESAS(瑞萨) 07+ QFP 130
4355 TMS320F2812PGFA TI / 德州仪器 15+ QFP 4
4356 D78F0453 NEC 1035 QFP 183
4357 RT7083GQW-G0YY1 RICHTEK 22+ QFN 490
4358 HC32F460JETA HDSC华大 21+ LQFP48 52
4359 MX30LF1G08AA-TI MXIC 14+ BGA 8
4360 F59L2G81A-25T ESMT 14+ TSOP48 3
4361 F50L1G41LB-104I ESMT 19+ BGA 5
4362 MX30UF1G18AC-TI MXIC/旺宏 15+ TSOP48 10
4363 RTL8814AR REALTEK 16+ QFN 5
4364 QT6220X ON/安森美 20+ BGA 10
4365 BCM3451KMLG BROADCOM/博通 16+ QFN 58
4366 QCN-9074-1-MSP234-TR-01-0 QUALCOMM 20+ BGA 26
4367 FC50L04SMVA-2.5BWE ESMT 19+ BGA 19
4368 K4A4G165WE-BCRC SAMSUNG 06+ BGA 3